Patent Assignment
Reel/Frame 036092/0073
Assignment of Assignor's Interest
Recorded: 2015-07-15
Pages: 9
Assignors
LIU, MING CHYI
Executed: 2015-07-06
WU, CHANG-MING
Executed: 2015-07-06
LIU, SHIH-CHANG
Executed: 2015-07-14
CHANG, YU-HSING
Executed: 2015-07-09
TSENG, YUAN-TAI
Executed: 2015-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure with Emedded EFS3 and Finfet Device