Patent Assignment
Reel/Frame 036096/0833
Assignment of Assignor's Interest
Recorded: 2015-07-15
Pages: 2
Assignor
LIU, CHIEN-HUNG
Executed: 2015-06-18
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same