Patent Assignment
Reel/Frame 036104/0093
Assignment of Assignor's Interest
Recorded: 2015-07-15
Pages: 4
Assignors
SEKINE, NAOKI
Executed: 2015-06-03
NAKAZAWA, MOTOKI
Executed: 2015-06-05
NAGASHIMA, YASUO
Executed: 2015-06-03
Assignee
SHINKAWA LTD.
2-51-1 INADAIRA, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire-Bonding Apparatus and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.