Patent Assignment
Reel/Frame 036109/0913
Assignment of Assignor's Interest
Recorded: 2015-07-16
Pages: 2
Assignors
CHANG, CHIH-HORNG
Executed: 2014-10-07
KUO, TIN-HAO
Executed: 2014-10-07
CHEN, CHEN-SHIEN
Executed: 2014-10-07
LIN, YEN-LIANG
Executed: 2014-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structure Having a Side Recess and Semiconductor Structure Including the Same