IP Library › Assignment 036116/0467
Patent Assignment
Reel/Frame 036116/0467

Assignment of Assignor's Interest

Recorded: 2015-07-16 Pages: 8
Assignors
LEUNG, CHI HO
Executed: 2015-07-13
XUE, KE
Executed: 2015-07-13
HABENICHT, SOENKE
Executed: 2015-07-13
HOR, WAI HUNG WILLIAM
Executed: 2015-07-13
CHAN, SAN MING
Executed: 2015-07-13
NG, WAI KEUNG
Executed: 2015-07-13
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Leadless Semiconductor Package and Method
Patent: 9,443,791 →
Application: 14/801,635 →
Publication: US 2016/0035651
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
Release of Security Interest Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →