Patent Assignment
Reel/Frame 036117/0351
Assignment of Assignor's Interest
Recorded: 2015-07-17
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating a Semiconductor Device Having a via Structure and an Interconnection Structure