Patent Assignment
Reel/Frame 036118/0689
Assignment of Assignor's Interest
Recorded: 2015-07-17
Pages: 4
Assignors
KOTAKE, TOMOHIKO
Executed: 2015-07-01
TSUCHIKAWA, SHINJI
Executed: 2015-07-01
IZUMI, HIROYUKI
Executed: 2015-07-01
MIYATAKE, MASATO
Executed: 2015-07-01
TAKANEZAWA, SHIN
Executed: 2015-07-01
MURAI, HIKARI
Executed: 2015-07-01
IRINO, TETSUROU
Executed: 2015-07-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →