IP Library Assignment 036132/0569
Patent Assignment
Reel/Frame 036132/0569

Assignment of Assignor's Interest

Recorded: 2015-07-20 Pages: 6
Assignors
LIBBERT, JEFFREY L.
Executed: 2015-05-05
VAYPAYEE, SHILPI
Executed: 2015-06-06
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01, STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property (1)
Method of Manufacturing High Resistivity Soi Substrate with Reduced Interface Conducitivity
Patent: 9,209,069 →
Application: 14/510,929 →
Publication: US 2015/0104926
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →