Patent Assignment
Reel/Frame 036144/0456
Assignment of Assignor's Interest
Recorded: 2015-07-21
Pages: 6
Assignors
JO, CHA-JEA
Executed: 2015-04-13
IM, YUN-HYEOK
Executed: 2015-04-13
CHO, TAE-JE
Executed: 2015-04-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Stacked Semiconductor Chips