IP Library Assignment 036148/0327
Patent Assignment
Reel/Frame 036148/0327

Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 035894 Frame: 0678. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2015-07-21 Pages: 7
Assignors
STUBER, MICHAEL A.
Executed: 2015-07-14
MOLIN, STUART B.
Executed: 2015-07-14
Assignee
IO SEMICONDUCTOR INCORPORATED
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Back-To-Back Stacked Integrated Circuit Assembly and Method of Making
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 11, 2014
From: IO SEMICONDUCTOR, INC.
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 033134/0338 →
Assignment of Assignor's Interest Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0678 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 033134 Frame: 0338. Assignor(S) Hereby Confirms the Change of Name. Jul 15, 2015
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036109/0237 →
Assignment of Assignor's Interest May 23, 2016
From: QUALCOMM SWITCH CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 038794/0663 →