Patent Assignment
Reel/Frame 036109/0237
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 033134 Frame: 0338. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2015-07-15
Pages: 8
Assignor
IO SEMICONDUCTOR INCORPORATED
Executed: 2014-04-29
Assignee
SILANNA SEMICONDUCTOR U.S.A., INC.
4795 EASTGATE MALL, SAN DIEGO, CALIFORNIA, 92121
Covered Properties
(40)
Semiconductor-On-Insulator with Backside Heat Dissipation
PCT:
PCT/US2010/042026 ↗
Semiconductor-On-Insulator with Back Side Support Layer
PCT:
PCT/US2010/042027 ↗
Semiconductor-On-Insulator with Back Side Body Connection
PCT:
PCT/US2010/042028 ↗
Vertical Semiconductor Device with Thinned Substrate
PCT:
PCT/US2011/055671 ↗
Trap Rich Layer for Semiconductor Devices
PCT:
PCT/US2011/063800 ↗
Charge Pump Regulator Circuit
PCT:
PCT/US2013/040719 ↗
Charge Pump Regulator Circuit
PCT:
PCT/US2013/049623 ↗
Back-To-Back Stacked Integrated Circuit Assembly and Method of Making
PCT:
PCT/US2013/073466 ↗
Semiconductor-On-Insulator Integrated Circuit with Interconnect Below the Insulator
PCT:
PCT/US2014/030553 ↗
Semiconductor-On-Insulator with Back Side Connection
Semiconductor-On-Insulator with Back Side Support Layer
Semiconductor-On-Insulator with Back Side Heat Dissipation
Vertical Semiconductor Device with Thinned Substrate
Vertical Semiconductor Device with Thinned Substrate
Thermal Conduction Paths for Semiconductor Structures
Trap Rich Layer for Semiconductor Devices
Semiconductor-On-Insulator with Back Side Strain Inducing Material
Semiconductor-On-Insulator with Back Side Connection
Charge Pump Regulator Circuit with a Variable Drive Voltage Ring Oscillator
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Trap Rich Layer Formation Techniques for Semiconductor Devices
Charge Pump Regulator Circuit
Patent:
8,497,670 →
Application:
13/720,589 →
Thin Integrated Circuit Chip-on-Board Assembly and Method of Making
Integrated Circuit Assembly and Method of Making
Back-To-Back Stacked Integrated Circuit Assembly and Method of Making
Semiconductor-on-Insulator with Back Side Body Connection
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Semiconductor-On-Insulator Integrated Circuit with Interconnect Below the Insulator
Patent:
8,748,245 →
Application:
13/851,926 →
Vertical Semiconductor Device with Thinned Substrate
Double-Sided Vertical Semiconductor Device with Thinned Substrate
Compact Level Shifter
Methods for the Formation of a Trap Rich Layer
Charge Pump Regulator Circuit with Variable Amplitude Control
Trap Rich Layer Formation Techniques for Semiconductor Devices
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Bonded Semiconductor Structure with Sigec Layer as Etch Stop
Patent:
9,105,689 →
Application:
14/223,060 →
Low Capacitance Integrated Circuit for Rf Applications
Application:
61/225,914 →
Low Capacitance Vertical Power Device
Application:
61/392,419 →
Thermal Conduction Paths for SOI Structures
Application:
61/422,650 →
Trip Rich Layer for SOI Devices
Application:
61/427,167 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 8, 2012
From: MOLIN, STUART B.; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR, INC.
Reel/Frame 028752/0792 →
Assignment of Assignor's Interest
Oct 15, 2012
From: ARRIAGADA, ANTON; BRINDLE, CHRIS; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR, INC.
Reel/Frame 029131/0822 →
Assignment of Assignor's Interest
Nov 26, 2012
From: ARRIAGADA, ANTON; STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR, INC.
Reel/Frame 029347/0034 →
Assignment of Assignor's Interest
Dec 21, 2012
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR, INC.
Reel/Frame 029521/0836 →
Security Agreement
Feb 4, 2013
From: IO SEMICONDUCTOR INCORPORATED
To: HSBC BANK AUSTRALIA LIMITED
Reel/Frame 029751/0726 →
Change of Name
Jun 11, 2014
From: IO SEMICONDUCTOR, INC.
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 033134/0338 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; BRINDLE, CHRIS
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035897/0602 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0612 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0678 →
Assignment of Assignor's Interest
Jun 24, 2015
From: BRINDLE, CHRIS; STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0640 →
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0624 →
Assignment of Assignor's Interest
Jun 24, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0625 →
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0648 →
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; NYGAARD, PAUL A.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0618 →
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0822 →
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0779 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0573 →
Assignment of Assignor's Interest
Jun 24, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0610 →
Assignment of Assignor's Interest
Jul 9, 2015
From: STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036045/0625 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 035901 Frame 0612. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0868 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 024694 Frame: 0303. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0807 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 035894 Frame 0618. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: MOLIN, STUART B.; NYGAARD, PAUL A.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0846 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 024694 Frame 0315. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0857 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 035894 Frame: 0610. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0878 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 035901 Frame: 0625. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0887 →