Granted Patent B2

US 8,912,646 · App. 13/725,306 · Granted Dec 16, 2014

Abstract

Claims (19)

1. An integrated circuit assembly comprising:

an insulating layer having a first surface and a second surface;

a first active layer contacting the first surface of the insulating layer;

a metal bond pad formed on the second surface of the insulating layer;

wherein the metal bond pad is electrically connected to the first active layer;

a substrate having a first surface and a second surface, the first active layer being coupled to the second surface of the substrate;

a second active layer formed on the first surface of the substrate;

a first wafer including the insulating layer and the first active layer; and

a second wafer bonded to the first wafer, the second wafer including the substrate and the second active layer.

2. The integrated circuit assembly of claim 1 , further comprising:

a printed circuit board, the printed circuit board being electrically connected to the metal bond pad.

3. The assembly of claim 1 , wherein the substrate is less than 100 microns thick.

4. The assembly of claim 1 , wherein the substrate is less than 50 microns thick.

5. The assembly of claim 1 , wherein the substrate is less than 30 microns thick.

6. The assembly of claim 1 , wherein the first active layer or the second active layer includes passive devices.

7. The assembly of claim 2 , wherein the printed circuit board is electrically connected with a solder bump to the first active layer.

8. The assembly of claim 2 , wherein the printed circuit board is electrically connected to the second active layer through a wire bond.

9. The assembly of claim 2 , wherein the printed circuit board is electrically connected with a solder bump to the second active layer.

10. The assembly of claim 2 , wherein the printed circuit board is electrically connected to the first layer through a wire bond.

Assignments (9)