Patent Assignment
Reel/Frame 036877/0140
Change of Name
Recorded: 2015-10-16
Pages: 6
Assignor
SILANNA SEMICONDUCTOR U.S.A., INC.
Executed: 2015-10-05
Assignee
QUALCOMM SWITCH CORP.
4795 EASTGATE MALL, SUITE 100, SAN DIEGO, CALIFORNIA, 92121
Covered Properties
(68)
Semiconductor-On-Insulator Integrated Circuit with Interconnect Below the Insulator
PCT:
PCT/US2014/030553 ↗
Bonded Semiconductor Structure with Sigec Layer as Etch Stop
PCT:
PCT/US2015/021243 ↗
Semiconductor Structure with Multiple Active Layers in an Soi Wafer
PCT:
PCT/US2015/041769 ↗
Semiconductor Device with Self-Aligned Back Side Features
PCT:
PCT/US2015/042483 ↗
Emi Shield for High Frequency Layer Transferred Devices
PCT:
PCT/US2015/043287 ↗
Schottky Clamped Radio Frequency Switch
PCT:
PCT/US2015/050096 ↗
Semiconductor-On-Insulator with Back Side Connection
Semiconductor-On-Insulator with Back Side Support Layer
Semiconductor-On-Insulator with Back Side Heat Dissipation
Vertical Semiconductor Device with Thinned Substrate
Vertical Semiconductor Device with Thinned Substrate
Thermal Conduction Paths for Semiconductor Structures
Trap Rich Layer for Semiconductor Devices
Semiconductor-On-Insulator with Back Side Strain Inducing Material
Semiconductor-On-Insulator with Back Side Connection
Charge Pump Regulator Circuit with a Variable Drive Voltage Ring Oscillator
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Trap Rich Layer Formation Techniques for Semiconductor Devices
Charge Pump Regulator Circuit
Patent:
8,497,670 →
Application:
13/720,589 →
Thin Integrated Circuit Chip-on-Board Assembly and Method of Making
Integrated Circuit Assembly and Method of Making
Back-To-Back Stacked Integrated Circuit Assembly and Method of Making
Semiconductor-on-Insulator with Back Side Body Connection
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Semiconductor-On-Insulator Integrated Circuit with Interconnect Below the Insulator
Patent:
8,748,245 →
Application:
13/851,926 →
Vertical Semiconductor Device with Thinned Substrate
Double-Sided Vertical Semiconductor Device with Thinned Substrate
Compact Level Shifter
Methods for the Formation of a Trap Rich Layer
Charge Pump Regulator Circuit with Variable Amplitude Control
Trap Rich Layer Formation Techniques for Semiconductor Devices
Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices
Bonded Semiconductor Structure with Sigec Layer as Etch Stop
Patent:
9,105,689 →
Application:
14/223,060 →
Semiconductor-On-Insulator Integrated Circuit with Interconnect Below the Insulator
High Density Single-Transistor Antifuse Memory Cell
Redistribution Layer Contacting First Wafer Through Second Wafer
Semiconductor-on-Insulator Integrated Circuit with Reduced Off-State Capacitance
Semiconductor-On-Insulator Integrated Circuit with Back Side Gate
Semiconductor Device with Self-Aligned Back Side Features
Emi Shield for High Frequency Layer Transferred Devices
Semiconductor Structure with Multiple Active Layers in an Soi Wafer
Application:
14/454,262 →
Publication:
US 2016/0043108
Forming Semiconductor Structure with Device Layers and Trl
Integrated Phase Change Switch
Methods for the Formation of a Trap Rich Layer
Schottky Clamped Radio Frequency Switch
Patent:
9,177,968 →
Application:
14/491,783 →
Low Power Externally Biased Power-on-Reset Circuit
Semiconductor Structure with Active Device and Damaged Region
Semiconductor-on-Insulator with Back Side Strain Topology
Integrated Circuit Assembly and Method of Making
Vertical Semiconductor Device with Thinned Substrate
Thin Integrated Circuit Chip-on-Board Assembly
Integrated Circuit Assembly with Faraday Cage
Semiconductor Structure with Trl and Handle Wafer Cavities
Rf Circuit with Switch Transistor with Body Connection
Bonded Semiconductor Structure with Sigec/Sigebc Layer as Etch Stop
Rf Circuit with Switch Transistor with Body Connection
Etch Stop Region Based Fabrication of Bonded Semiconductor Structures
Patent:
9,466,729 →
Application:
14/707,367 →
Semiconductor-On-Insulator with Back Side Support Layer
Bulk Layer Transfer Wafer with Multiple Etch Stop Layers
Trap Rich Layer Formation Techniques for Semiconductor Devices
Charge Pump Regulator Circuit
Conductive Seal Ring for Power Bus Distribution
Double-Sided Vertical Semiconductor Device with Thinned Substrate
Application:
14/824,491 →
Publication:
US 2015/0364597
Trap Rich Layer for Semiconductor Devices
Low Capacitance Integrated Circuit for Rf Applications
Application:
61/225,914 →
Low Capacitance Vertical Power Device
Application:
61/392,419 →
Thermal Conduction Paths for SOI Structures
Application:
61/422,650 →
Trip Rich Layer for SOI Devices
Application:
61/427,167 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 24, 2015
From: MOLIN, STUART B.; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0648 →
Change of Name
Jun 24, 2015
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036016/0670 →
Assignment of Assignor's Interest
Jun 24, 2015
From: FANELLI, STEPHEN A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035894/0681 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; BRINDLE, CHRIS
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035897/0602 →
Assignment of Assignor's Interest
Jun 24, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0612 →
Assignment of Assignor's Interest
Jun 24, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 035901/0625 →
Assignment of Assignor's Interest
Jul 9, 2015
From: STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036045/0625 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 033134 Frame: 0338. Assignor(S) Hereby Confirms the Change of Name.
Jul 15, 2015
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036109/0237 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 035894 Frame: 0681. Assignor(S) Hereby Confirms the Assignment.
Jul 15, 2015
From: FANELLI, STEPHEN A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036107/0112 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 027059 Frame: 0200. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0956 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 027337 Frame: 0346. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: STUBER, MICHAEL A.; BRINDLE, CHRIS; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036139/0014 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 024694 Frame: 0303. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0807 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 024694 Frame 0315. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0857 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 035901 Frame 0612. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; NYGAARD, PAUL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0868 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 035901 Frame: 0625. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: NYGAARD, PAUL A.; MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0887 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 029521 Frame 0836. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0906 →
Corrective Assignment to Correct the Assignee Name in the Assignment Document Previously Recorded at Reel: 029522 Frame: 0121. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0930 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 027059 Frame: 0203. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: MOLIN, STUART B.; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0978 →
Corrective Assignment to Correct the Assignee Name in the Assignment Document Previously Recorded at Reel: 035901 Frame: 0648. Assignor(S) Hereby Confirms the Assignment.
Jul 21, 2015
From: MOLIN, STUART B; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0418 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 035897 Frame 0602. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 21, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; BRINDLE, CHRIS
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0541 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 027361 Frame 0345. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 21, 2015
From: BRINDLE, CHRIS; STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0294 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 029347 Frame 0034. Assignor(S) Hereby Confirms the Assignee Name Should Be "Io Semiconductor Incorporated".
Jul 21, 2015
From: ARRIAGADA, ANTON; STUBER, MICHAEL A.; MOLIN, STUART B.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0390 →
Corrective Assignment to Correct the Assignee Name in the Assignment Document Previously Recorded at Reel: 029131 Frame: 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 21, 2015
From: ARRIAGADA, ANTON; BRINDLE, CHRIS; STUBER, MICHAEL A.
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0400 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 028752 Frame: 0792. Assignor(S) Hereby Confirms the Assignment.
Jul 21, 2015
From: MOLIN, STUART B; LOU, PERRY; KEMERLING, CLINT
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036148/0498 →
Assignment of Assignor's Interest
Aug 7, 2015
From: FANELLI, STEPHEN A.
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036275/0995 →