Patent Assignment
Reel/Frame 036159/0001
Assignment of Assignor's Interest
Recorded: 2015-07-23
Pages: 3
Assignors
KAKUTANI, OSAMU
Executed: 2015-06-16
KAWAMURA, TAKATOSHI
Executed: 2015-06-18
SEYAMA, KOHEI
Executed: 2015-06-18
SATO, AKIRA
Executed: 2015-06-18
Assignee
SHINKAWA LTD.
2-51-1 INADAIRA, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Tool Cooling Apparatus and Method for Cooling Bonding Tool
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.