Patent Assignment
Reel/Frame 036183/0202
Assignment of Assignor's Interest
Recorded: 2015-07-27
Pages: 4
Assignors
LIU, HSING-CHIH
Executed: 2014-05-16
YANG, CHIA-HAO
Executed: 2014-05-19
CHEN, YING-CHIH
Executed: 2014-05-16
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Bonding Pad Arrangment Design for Multi-Die Semiconductor Package Structure