Patent Assignment
Reel/Frame 036209/0167
Assignment of Assignor's Interest
Recorded: 2015-07-29
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Ic Bump Height Metrology Apc