Patent Assignment
Reel/Frame 036219/0082
Assignment of Assignor's Interest
Recorded: 2015-07-30
Pages: 2
Assignor
MORITA, TAKESHI
Executed: 2014-05-20
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO, 615-8585, JAPAN
Covered Property
(1)
Semiconductor Device Having a Multi-Level Interconnection Structure