Patent Assignment
Reel/Frame 036221/0283
Assignment of Assignor's Interest
Recorded: 2015-07-30
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2015-06-23
WU, CHI-HSI
Executed: 2015-06-26
YU, CHEN-HUA
Executed: 2015-06-24
YEH, DER-CHYANG
Executed: 2015-06-23
WU, WEI-CHENG
Executed: 2015-06-23
TSENG, CHIEN-FU
Executed: 2015-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices