Patent Assignment
Reel/Frame 036233/0625
Assignment of Assignor's Interest
Recorded: 2015-07-31
Pages: 4
Assignee
PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.
3F., NO. 369, SEC. 2, WENHUA 2ND RD., LINKOU DIST., NEW TAIPEI CITY, 244, TAIWAN
Covered Property
(1)
Method of Manufacturing a Multichip Package Structure