Patent Assignment
Reel/Frame 036259/0709
Assignment of Assignor's Interest
Recorded: 2015-08-05
Pages: 6
Assignors
JEE, YOUNG-KUN
Executed: 2015-03-23
MIN, TAE-HONG
Executed: 2015-03-26
SEO, SUN-KYOUNG
Executed: 2015-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-Stacked Semiconductor Package