IP Library › Assignment 036284/0567
Patent Assignment
Reel/Frame 036284/0567

Assignment of Assignor's Interest

Recorded: 2015-08-09 Pages: 6
Assignors
HEO, JUNYEONG
Executed: 2015-06-26
JO, CHAJEA
Executed: 2015-06-26
CHO, TAEJE
Executed: 2015-06-26
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package Having Stacked Chips and a Heat Dissipation Part and Method of Fabricating the Same
Patent: 9,875,992 →
Application: 14/821,767 →
Publication: US 2016/0079208
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 25, 2016
From: HEO, JUNYEONG; JO, CHAJEA; CHO, TAEJE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 040124/0062 →