Patent Assignment
Reel/Frame 036296/0216
Assignment of Assignor's Interest
Recorded: 2015-08-11
Pages: 2
Assignors
CHEN, WEI-YU
Executed: 2015-07-30
CHEN, HSIEN-WEI
Executed: 2015-07-30
SU, AN-JHIH
Executed: 2015-07-30
HSIEH, CHENG-HSIEN
Executed: 2015-07-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Under Bump Metallurgy (Ubm) and Methods of Forming Same