Patent Assignment
Reel/Frame 036297/0930
Assignment of Assignor's Interest
Recorded: 2015-08-11
Pages: 3
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
A Multi-Layer Resin Substrate Having Grounding Conductors Configured to Form Triplate Line Sections and Microstrip Sections