Patent Assignment
Reel/Frame 036319/0388
Assignment of Assignor's Interest
Recorded: 2015-08-13
Pages: 7
Assignors
CHOE, YEONG-HWAN
Executed: 2015-08-13
HWANG, TAE-JOO
Executed: 2015-08-13
MIN, TAE-HONG
Executed: 2015-08-13
JEE, YOUNG-KUN
Executed: 2015-08-13
HAN, SANG-UK
Executed: 2015-08-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Stacked Semiconductor Chips Interconnected via Tsv and Method of Fabricating the Same