Patent Assignment
Reel/Frame 036319/0891
Assignment of Assignor's Interest
Recorded: 2015-08-13
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
MEMS Packages and Methods of Manufacture Thereof