Patent Assignment
Reel/Frame 036322/0554
Assignment of Assignor's Interest
Recorded: 2015-08-13
Pages: 4
Assignors
CHEN, MENG-TSE
Executed: 2015-06-29
LIU, CHUNG-SHI
Executed: 2015-07-10
LIN, CHIH-WEI
Executed: 2015-06-29
HUANG, HUI-MIN
Executed: 2015-06-29
KUO, HSUAN-TING
Executed: 2015-06-29
CHENG, MING-DA
Executed: 2015-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Package Structure and Methods of Forming Same