Patent Assignment
Reel/Frame 036329/0316
Assignment of Assignor's Interest
Recorded: 2015-08-14
Pages: 11
Assignors
OOHIRAKI, TOMOYA
Executed: 2015-06-16
OI, SOTARO
Executed: 2015-06-16
NISHIKAWA, KIMIHITO
Executed: 2015-06-08
HAYASHI, HIROMASA
Executed: 2015-06-04
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008117, JAPAN
Covered Property
(1)
Manufacturing Method of Power-Module Substrate