Patent Assignment
Reel/Frame 036349/0644
Assignment of Assignor's Interest
Recorded: 2015-08-18
Pages: 5
Assignors
OH, KWANG YONG
Executed: 2015-08-17
BYUN, HO JUN
Executed: 2015-08-18
KIM, HYUCK JUN
Executed: 2015-08-17
NAM, KI BUM
Executed: 2015-08-17
KIM, SU YEON
Executed: 2015-08-17
Assignee
SEOUL SEMICONDUCTOR CO., LTD.
1B-25, 97-11, SANDAN-RO 163BEON-GIL, DANWON-GU, GYEONGGI-DO, ANSAN-SI, 425-851, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Diode Package and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 070293/0273 →
Assignment of Assignor's Interest
Mar 26, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070636/0815 →
Change of Name
Mar 26, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070643/0907 →