Patent Assignment
Reel/Frame 036356/0213
Assignment of Assignor's Interest
Recorded: 2015-08-14
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device and Semiconductor Package with Thermally Conductive Via