IP Library Assignment 036387/0126
Patent Assignment
Reel/Frame 036387/0126

Assignment of Assignor's Interest

Recorded: 2015-08-21 Pages: 5
Assignors
HUNG, CHING-WEN
Executed: 2013-04-25
HUANG, CHIH-SEN
Executed: 2013-04-25
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Manufacturing Method for Forming Semiconductor Structure
Patent: 9,331,171 →
Application: 14/831,881 →
Publication: US 2015/0357431
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →