Patent Assignment
Reel/Frame 036404/0666
Assignment of Assignor's Interest
Recorded: 2015-08-24
Pages: 4
Assignors
WU, WEI-CHENG
Executed: 2011-03-03
HU, HSIEN-PIN
Executed: 2011-03-07
HOU, SHANG-YUN
Executed: 2011-03-04
JENG, SHIN-PUU
Executed: 2011-03-07
YU, CHEN-HUA
Executed: 2011-03-09
YANG, CHAO-HSIANG
Executed: 2011-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Testing of Semiconductor Chips with Microbumps