Patent Assignment
Reel/Frame 036406/0749
Assignment of Assignor's Interest
Recorded: 2015-08-25
Pages: 4
Assignors
TSAI, WEN-CHING
Executed: 2015-08-11
CHEN, MING-FA
Executed: 2015-08-11
YU, CHEN-HUA
Executed: 2015-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Three Dimensional Integrated Circuit Structure and Method of Manufacturing the Same