Patent Assignment
Reel/Frame 036427/0255
Assignment of Assignor's Interest
Recorded: 2015-08-26
Pages: 9
Assignors
OOKITA, KENZOU
Executed: 2015-08-19
ARITOME, ISAO
Executed: 2015-08-19
KURIYAMA, KEISUKE
Executed: 2015-08-20
MATSUMOTO, TAICHI
Executed: 2015-08-19
WATANABE, KAZUTO
Executed: 2015-08-21
KOBAYASHI, ATSUSHI
Executed: 2015-08-19
SHIMODA, SUGIROU
Executed: 2015-08-19
Assignee
JSR CORPORATION
1-9-2 HIGASHI-SHINBASHI, MINATO-KU, TOKYO, 105-8640, JAPAN
Covered Property
(1)
Method for Forming Three-Dimensional Interconnection, Circuit Arrangement Comprising Three-Dimensional Interconnection, and Metal Film-Forming Composition for Three-Dimensional Interconnection