Patent Assignment
Reel/Frame 036440/0324
Assignment of Assignor's Interest
Recorded: 2015-08-27
Pages: 6
Assignors
CHIU, CHIH-HSIEN
Executed: 2014-08-22
FANG, HAO-JU, MR.
Executed: 2014-08-22
CHUNG, HSIN-LUNG
Executed: 2014-08-22
CHANG, CHO-HSIN, MR.
Executed: 2014-08-22
TSAI, TSUNG-HSIEN
Executed: 2014-08-22
CHEN, CHIA-YANG
Executed: 2014-08-22
KE, CHUN-CHI
Executed: 2014-08-22
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Having Metal Layer