Patent Assignment
Reel/Frame 036486/0503
Assignment of Assignor's Interest
Recorded: 2015-09-03
Pages: 7
Assignors
WU, JIANN LIH
Executed: 2015-08-19
YANG, CHI-MING
Executed: 2015-08-17
HWANG, JAMES JENG-JYI
Executed: 2015-08-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chemical Mechanical Polishing (Cmp) Platform for Local Profile Control