Patent Assignment
Reel/Frame 036491/0529
Assignment of Assignor's Interest
Recorded: 2015-09-03
Pages: 4
Assignors
LEE, KEVIN J.
Executed: 2011-09-30
BOHR, MARK T.
Executed: 2011-09-30
YEOH, ANDREW W.
Executed: 2011-09-30
PELTO, CHRISTOPHER M.
Executed: 2011-09-30
KOTHARI, HITEN
Executed: 2011-09-30
SATTIRAJU, SESHU V.
Executed: 2011-09-30
MA, HANG-SHING
Executed: 2011-09-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
3D Interconnect Structure Comprising Through-Silicon Vias Combined with Fine Pitch Backside Metal Redistribution Lines Fabricated Using a Dual Damascene Type Approach
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.