Patent Assignment
Reel/Frame 036506/0896
Assignment of Assignor's Interest
Recorded: 2015-09-08
Pages: 6
Assignors
SEO, SUNKYOUNG
Executed: 2015-06-25
JO, CHAJEA
Executed: 2015-06-25
KIM, JI HWANG
Executed: 2015-06-25
CHO, TAEJE
Executed: 2015-06-29
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Electronic Device Having Heat Dissipation Pattern and/or Heat Conducting Line