Patent Assignment
Reel/Frame 036513/0726
Assignment of Assignor's Interest
Recorded: 2015-09-08
Pages: 5
Assignors
TAGAMI, SHOHEI
Executed: 2015-07-17
SUGO, MICHIHIRO
Executed: 2015-07-17
TANABE, MASAHITO
Executed: 2015-07-17
KATO, HIDETO
Executed: 2015-07-24
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Processing Laminate, Temporary Adhesive Material for Wafer Processing, and Method for Manufacturing Thin Wafer