IP Library Assignment 036525/0497
Patent Assignment
Reel/Frame 036525/0497

Assignment of Assignor's Interest

Recorded: 2015-09-09 Pages: 2
Assignors
HUISKAMP, PAUL
Executed: 2015-03-19
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Metallisation for Semiconductor Device
Application: 14/849,469 →
Publication: US 2016/0104676
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
Change of Address Oct 25, 2018
From: NEXPERIA B.V.
To: NEXPERIA B.V.
Reel/Frame 047901/0018 →
Release of Security Interest Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →