Patent Assignment
Reel/Frame 036557/0303
Assignment of Assignor's Interest
Recorded: 2015-09-14
Pages: 11
Assignors
THOMAS, TESSIL
Executed: 2015-01-15
STEINBRECHER, ROBIN A.
Executed: 2014-12-18
AHUJA, SANDEEP
Executed: 2015-01-16
BERKTOLD, MICHAEL
Executed: 2015-01-06
KAM, TIMOTHY Y.
Executed: 2015-01-06
CHIN, HOWARD
Executed: 2015-01-05
KANDULA, PHANI KUMAR
Executed: 2014-12-22
SISTLA, KRISHNAKANTH V.
Executed: 2015-09-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Apparatus and Method to Provide a Thermal Parameter Report for a Multi-Chip Package