Patent Assignment
Reel/Frame 036561/0236
Assignment of Assignor's Interest
Recorded: 2015-09-14
Pages: 2
Assignee
INVENSENSE, INC.
1745 TECHNOLOGY DRIVE, SUITE 200, SAN JOSE, CALIFORNIA, 95110
Covered Property
(1)
Method of Fabrication of Ai/Ge Bonding in a Wafer Packaging Environment and a Product Produced Therefrom