Patent Assignment
Reel/Frame 036567/0279
Assignment of Assignor's Interest
Recorded: 2015-09-15
Pages: 6
Assignors
TERUI, MAKOTO
Executed: 2015-07-29
TOMINAGA, RYOJIRO
Executed: 2015-08-18
KUNIEDA, MASATOSHI
Executed: 2015-07-29
SAWADA, NORIKI
Executed: 2015-08-18
Assignee
IBIDEN CO., LTD.
2-1 KANDA-CHO, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Substrate and Method for Manufacturing the Same