Patent Assignment
Reel/Frame 036578/0862
Assignment of Assignor's Interest
Recorded: 2015-09-16
Pages: 4
Assignee
CORNING INCORPORATED
SP-TI-03-01, CORNING, NEW YORK, 14831
Covered Property
(1)
Etch Back Processes of Bonding Material for the Manufacture of Through-Glass Vias
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.