Patent Assignment
Reel/Frame 036618/0126
Assignment of Assignor's Interest
Recorded: 2015-09-22
Pages: 3
Assignee
SHIBAURA MECHATRONICS CORPORATION
5-1, KASAMA 2-CHOME, SAKAE-KU, YOKOHAMA-SHI, KANAGAWA-KEN, JAPAN
Covered Property
(1)
Bonding Apparatus and Method for Manufacturing Bonded Substrate