Patent Assignment
Reel/Frame 036622/0172
Assignment of Assignor's Interest
Recorded: 2015-09-22
Pages: 3
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.