Patent Assignment
Reel/Frame 067568/0674
Change of Name
Recorded: 2024-05-30
Pages: 3
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties
(3)
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 12, 2015
From: LIN, YAOJIAN; CHEN, KANG; FANG, JIANMIN; FENG, XIA
To: STATS CHIPPAC, LTD.
Reel/Frame 034951/0888 →
Assignment of Assignor's Interest
Sep 22, 2015
From: LIN, YAOJIAN; CHEN, KANG
To: STATS CHIPPAC, LTD.
Reel/Frame 036622/0172 →
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →