Patent Assignment
Reel/Frame 034951/0888
Assignment of Assignor's Interest
Recorded: 2015-02-12
Pages: 6
Assignors
LIN, YAOJIAN
Executed: 2015-02-12
CHEN, KANG
Executed: 2015-02-12
FANG, JIANMIN
Executed: 2015-02-09
FENG, XIA
Executed: 2015-02-09
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Change of Name
May 30, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067568/0674 →