IP Library › Assignment 052972/0001
Patent Assignment
Reel/Frame 052972/0001

RELEASE OF SECURITY INTEREST

Recorded: 2020-06-18 Received: 2020-06-18 Pages: 25
Assignor
Assignees
STATS CHIPPAC, INC.
46429 LANDING PARKWAY, FREMONT, CA, 94538, UNITED STATES
STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Applications (61)
PATIENT SUPPORT APPARATUS TRACKING SYSTEM
App. No. 16/904,644
→
RICH MARKER FOR MAPPING APPLICATIONS
App. No. 16/904,307
→
METHOD AND APPARATUS USING CONTEXT TO DETERMINE CONSUMER DEALS
App. No. 16/904,152
→
WET DRY INTEGRATED CIRCULATION COOLING SYSTEM
App. No. 16/902,794
→
DOUBLE SENSE PROGRAM VERIFICATION OF A MEMORY ARRAY
App. No. 16/352,697
→
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
App. No. 14/624,136
→
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App. No. 14/616,942
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURE THEREOF
App. No. 14/556,992
→
CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
App. No. 14/214,765
→
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package
App. No. 14/139,614
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VIALESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 14/136,513
→
METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLASMA PROCESSING
App. No. 14/137,352
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF
App. No. 14/136,274
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SIDE SOLDERABLE LEADS AND METHOD OF MANUFACTURE THEREOF
App. No. 14/037,838
→
DUAL-SIDED FILM-ASSIST MOLDING PROCESS
App. No. 14/037,320
→
LEADFRAME SYSTEM WITH WARP CONTROL MECHANISM AND METHOD OF MANUFACTURE THEREOF
App. No. 13/949,432
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/928,754
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF
App. No. 13/844,160
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF
App. No. 13/842,305
→
INTEGRATED CIRCUIT HAVING STAGGERED BOND PADS AND I/O CELLS
App. No. 13/716,479
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD FRAME
App. No. 13/714,815
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSFERABLE TRACE LEAD FRAME
App. No. 13/714,865
→
EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM
App. No. 13/589,018
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLANARITY CONTROL AND METHOD OF MANUFACTURE THEREOF
App. No. 13/526,802
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF MANUFACTURE THEREOF
App. No. 13/494,721
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF
App. No. 13/489,850
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF
App. No. 13/489,282
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/488,812
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A GRID ARRAY WITH A LEADFRAME AND METHOD OF MANUFACTURE THEREOF
App. No. 13/428,251
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/427,221
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/425,768
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXTERNAL INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
App. No. 13/425,286
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/424,968
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS
App. No. 13/407,554
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/366,768
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/326,806
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/327,609
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/325,881
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
App. No. 13/243,555
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REDISTRIBUTION LAYER AND METHOD OF MANUFACTURE THEREOF
App. No. 13/221,894
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND EMBEDDED PADDLE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/187,505
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/166,438
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
App. No. 13/166,679
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/163,523
→
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING WAFER LEVEL CHIP SCALE PACKAGING
App. No. 12/709,425
→
LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
App. No. 12/709,073
→
METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
App. No. 12/699,787
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF
App. No. 12/561,897
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMPS AND METHOD OF MANUFACTURE THEREOF
App. No. 12/487,925
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LOCKING TERMINAL
App. No. 12/146,192
→
SEMICONDUCTOR PACKAGE SYSTEM WITH CUT MULTIPLE LEAD PADS
App. No. 12/131,037
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECT
App. No. 12/055,526
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STACKABLE MULTI-CHIP PACKAGE SYSTEM
App. No. 11/754,603
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING FEATURES FOR CLEARANCE
App. No. 11/694,913
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METHOD OF FABRICATING A SEMICONDUCTOR ASSEMBLY INCLUDING CHIP SCALE PACKAGE AND SECOND SUBSTRATE WITH EXPOSED SUBSTRATE SURFACES ON UPPER AND LOWER SIDES
App. No. 11/626,232
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BLOW MOLD ASSEMBLY
App. No. 11/253,111
→
APPARATUS FOR BLOW MOLDING
App. No. 11/227,266
→
APPARATUS FOR BLOW MOLDING
App. No. 11/054,283
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METHOD AND APPARATUS FOR BLOW MOLDING
App. No. 10/884,160
→
FABRICATION METHOD FOR SEMICONDUCTOR PACKAGE HEAT SPREADERS
App. No. 10/721,916
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QUICK RELEASE VOLUME CONTROL INSERTS FOR MOLDING MACHINES
App. No. 10/618,783
→