INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing a terminal having a cornered dimple formed therein as a simple concave polygon;

mounting an integrated circuit above and coupled to the terminal; and

forming an encapsulation encapsulating the integrated circuit and portions of the terminal.

2 . The method as claimed in claim 1 further comprising filling a conductor into the terminal cornered dimple.

3 . The method as claimed in claim 1 further comprising forming a plating layer lining the cornered dimple.

4 . The method as claimed in claim 1 wherein providing the terminal includes providing the terminal having the cornered dimple formed as an upper step and a lower step.

5 . The method as claimed in claim 1 wherein providing the terminal includes providing the terminal having a standoff portion formed thereon and encompassing the cornered dimple.

6 . A method of manufacture of an integrated circuit packaging system comprising:

providing a leadframe having a terminal, a die pad and a cornered dimple formed as a simple concave polygon;

mounting an integrated circuit over and coupled to the die pad;

connecting an interconnect between the integrated circuit and the terminal;

forming an encapsulation encapsulating the integrated circuit and portions of the terminal and the die pad; and

forming separation grooves in the leadframe separating the terminals and the die pad.

7 . The method as claimed in claim 6 wherein providing the leadframe includes providing the leadframe having the die pad having the cornered dimple formed therein.

8 . The method as claimed in claim 6 wherein providing the leadframe includes providing the leadframe having the cornered dimple includes the cornered dimple formed as a geometric pattern.

9 . The method as claimed in claim 6 wherein providing the leadframe includes providing the leadframe having the die pad with a standoff portion formed on the die pad.

10 . The method as claimed in claim 6 further comprising forming a plating layer on a top and on a bottom of the leadframe.

11 . An integrated circuit packaging system comprising:

a terminal with a terminal cornered dimple formed therein as a simple concave polygon;

an integrated circuit mounted above and coupled to the terminal; and

an encapsulation encapsulating the integrated circuit and portions of the terminal.

12 . The system as claimed in claim 11 further comprising a conductor filling the terminal cornered dimple.

13 . The system as claimed in claim 11 further comprising a plating layer lining the terminal cornered dimple.

14 . The system as claimed in claim 11 wherein the terminal includes the terminal cornered dimple formed as an upper step and a lower step.

15 . The system as claimed in claim 11 wherein the terminal includes a standoff portion formed on the terminal and encompassing the terminal cornered dimple.

16 . The system as claimed in claim 11 further comprising:

a die pad coupled to the terminal and attached to the integrated circuit; and

an interconnect between the integrated circuit and the terminal.

17 . The system as claimed in claim 16 wherein the die pad includes a die pad cornered dimple formed therein.

18 . The system as claimed in claim 16 wherein the terminal includes the terminal cornered dimple formed as a geometric pattern.

19 . The system as claimed in claim 16 wherein the die pad includes a standoff portion formed thereon.

20 . The system as claimed in claim 16 further comprising a plating layer formed on a top and on a bottom of the terminal.