Patent Assignment
Reel/Frame 039439/0240
CHANGE OF NAME
Recorded: 2016-07-22
Received: 2016-07-22
Pages: 5
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications
(19)
NOVEL CRISPR ENZYMES AND SYSTEMS
PCTPCTUS2016038258
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF
App. No. 14/980,292
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SUPPORT STRUCTURE MECHANISM AND METHOD OF MANUFACTURE THEREOF
App. No. 14/792,447
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF
App. No. 14/696,741
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VIALESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 14/136,513
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF
App. No. 14/136,274
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/928,754
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD FRAME
App. No. 13/714,815
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF MANUFACTURE THEREOF
App. No. 13/494,721
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A GRID ARRAY WITH A LEADFRAME AND METHOD OF MANUFACTURE THEREOF
App. No. 13/428,251
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/427,221
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/425,768
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/366,768
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/327,609
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/325,881
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD OF MANUFACTURE THEREOF
App. No. 13/243,474
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
App. No. 13/243,555
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/163,523
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LINK HAVING A TWISTED SIDE GUARD
App. No. 10/174,213
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